JPH059229B2 - - Google Patents

Info

Publication number
JPH059229B2
JPH059229B2 JP1257140A JP25714089A JPH059229B2 JP H059229 B2 JPH059229 B2 JP H059229B2 JP 1257140 A JP1257140 A JP 1257140A JP 25714089 A JP25714089 A JP 25714089A JP H059229 B2 JPH059229 B2 JP H059229B2
Authority
JP
Japan
Prior art keywords
cleaning
grinding
suction chuck
chuck mechanism
shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1257140A
Other languages
English (en)
Japanese (ja)
Other versions
JPH03121778A (ja
Inventor
Kazuo Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibayama Kikai Co Ltd
Original Assignee
Shibayama Kikai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibayama Kikai Co Ltd filed Critical Shibayama Kikai Co Ltd
Priority to JP1257140A priority Critical patent/JPH03121778A/ja
Publication of JPH03121778A publication Critical patent/JPH03121778A/ja
Publication of JPH059229B2 publication Critical patent/JPH059229B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cleaning In General (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP1257140A 1989-10-03 1989-10-03 半導体ウエハ研削盤における吸着チャック機構上面の洗浄装置 Granted JPH03121778A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1257140A JPH03121778A (ja) 1989-10-03 1989-10-03 半導体ウエハ研削盤における吸着チャック機構上面の洗浄装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1257140A JPH03121778A (ja) 1989-10-03 1989-10-03 半導体ウエハ研削盤における吸着チャック機構上面の洗浄装置

Publications (2)

Publication Number Publication Date
JPH03121778A JPH03121778A (ja) 1991-05-23
JPH059229B2 true JPH059229B2 (en]) 1993-02-04

Family

ID=17302272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1257140A Granted JPH03121778A (ja) 1989-10-03 1989-10-03 半導体ウエハ研削盤における吸着チャック機構上面の洗浄装置

Country Status (1)

Country Link
JP (1) JPH03121778A (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009277925A (ja) * 2008-05-15 2009-11-26 Tokyo Seimitsu Co Ltd クリーニング装置
JP2009283761A (ja) * 2008-05-23 2009-12-03 Tokyo Seimitsu Co Ltd 搬送パッドのクリーニング機構

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5443416A (en) * 1993-09-09 1995-08-22 Cybeq Systems Incorporated Rotary union for coupling fluids in a wafer polishing apparatus
JP7364338B2 (ja) * 2019-01-22 2023-10-18 株式会社ディスコ 保持面洗浄装置
CN112706060B (zh) * 2020-12-23 2021-11-09 上海新昇半导体科技有限公司 具有自清洗功能的双面抛光设备及抛光方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009277925A (ja) * 2008-05-15 2009-11-26 Tokyo Seimitsu Co Ltd クリーニング装置
JP2009283761A (ja) * 2008-05-23 2009-12-03 Tokyo Seimitsu Co Ltd 搬送パッドのクリーニング機構

Also Published As

Publication number Publication date
JPH03121778A (ja) 1991-05-23

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