JPH059229B2 - - Google Patents
Info
- Publication number
- JPH059229B2 JPH059229B2 JP1257140A JP25714089A JPH059229B2 JP H059229 B2 JPH059229 B2 JP H059229B2 JP 1257140 A JP1257140 A JP 1257140A JP 25714089 A JP25714089 A JP 25714089A JP H059229 B2 JPH059229 B2 JP H059229B2
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- grinding
- suction chuck
- chuck mechanism
- shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004140 cleaning Methods 0.000 claims description 36
- 230000007246 mechanism Effects 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 239000011148 porous material Substances 0.000 description 15
- 235000012431 wafers Nutrition 0.000 description 12
- 239000002344 surface layer Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Cleaning In General (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1257140A JPH03121778A (ja) | 1989-10-03 | 1989-10-03 | 半導体ウエハ研削盤における吸着チャック機構上面の洗浄装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1257140A JPH03121778A (ja) | 1989-10-03 | 1989-10-03 | 半導体ウエハ研削盤における吸着チャック機構上面の洗浄装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03121778A JPH03121778A (ja) | 1991-05-23 |
JPH059229B2 true JPH059229B2 (en]) | 1993-02-04 |
Family
ID=17302272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1257140A Granted JPH03121778A (ja) | 1989-10-03 | 1989-10-03 | 半導体ウエハ研削盤における吸着チャック機構上面の洗浄装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03121778A (en]) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009277925A (ja) * | 2008-05-15 | 2009-11-26 | Tokyo Seimitsu Co Ltd | クリーニング装置 |
JP2009283761A (ja) * | 2008-05-23 | 2009-12-03 | Tokyo Seimitsu Co Ltd | 搬送パッドのクリーニング機構 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5443416A (en) * | 1993-09-09 | 1995-08-22 | Cybeq Systems Incorporated | Rotary union for coupling fluids in a wafer polishing apparatus |
JP7364338B2 (ja) * | 2019-01-22 | 2023-10-18 | 株式会社ディスコ | 保持面洗浄装置 |
CN112706060B (zh) * | 2020-12-23 | 2021-11-09 | 上海新昇半导体科技有限公司 | 具有自清洗功能的双面抛光设备及抛光方法 |
-
1989
- 1989-10-03 JP JP1257140A patent/JPH03121778A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009277925A (ja) * | 2008-05-15 | 2009-11-26 | Tokyo Seimitsu Co Ltd | クリーニング装置 |
JP2009283761A (ja) * | 2008-05-23 | 2009-12-03 | Tokyo Seimitsu Co Ltd | 搬送パッドのクリーニング機構 |
Also Published As
Publication number | Publication date |
---|---|
JPH03121778A (ja) | 1991-05-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102142893B1 (ko) | 기판 이면의 연마 방법 및 기판 처리 장치 | |
KR101755177B1 (ko) | 허브 암들이 장착된 화학 기계적 폴리셔 | |
JP6329813B2 (ja) | 搬送ロボット | |
JPH11219930A (ja) | 洗浄装置 | |
KR100695980B1 (ko) | 기판세정장치 | |
CN217728158U (zh) | 双面研磨装置 | |
JPH01171762A (ja) | 半導体のウエハ研削盤の吸着チャック洗浄装置 | |
JP4451429B2 (ja) | 洗浄装置 | |
EP1088337A1 (en) | Semiconductor wafer cleaning apparatus and method | |
CN119017250B (zh) | 一种半导体晶圆研磨和抛光设备及研磨工艺 | |
KR100487589B1 (ko) | 평면 피가공물의 폴리싱과 세정방법 및 장치 | |
JP4808278B2 (ja) | 平面加工装置及び方法 | |
JP3892635B2 (ja) | 洗浄装置 | |
JPH059229B2 (en]) | ||
TW201922413A (zh) | 基板處理裝置及基板處理方法 | |
JP2006222467A (ja) | 平面加工装置 | |
CN100537142C (zh) | 化学机械抛光设备的清洗装置和方法 | |
JP4295469B2 (ja) | 研磨方法 | |
JP6736372B2 (ja) | 加工装置 | |
CN111842259A (zh) | 一种研磨垫修整器的清洁装置 | |
JPH11320385A (ja) | 研磨方法及びその装置 | |
JP2002016028A (ja) | 基板処理装置 | |
JP4850666B2 (ja) | ウエーハの加工装置 | |
JPH08148449A (ja) | バキュームチャックの研削屑除去用の洗浄装置 | |
JP3762176B2 (ja) | 洗浄装置 |